B16-Test Beamline
Metrology
|
Diamond Proposal Number(s):
[15400]
Abstract: We report on the production and testing of an array of active edge silicon sensors as a prototype of a large array. Four Medipix3RX.1 chips were bump bonded to four single chip sized Advacam active edge n-on-n sensors. These detectors were then mounted into a 2 by 2 array and tested on B16 at Diamond Light Source with an x-ray beam spot of 2um. The results from these tests, compared with optical metrology demonstrate that this type of sensor is sensitive to the physical edge of the silicon, with only a modest loss of efficiency in the final two rows of pixels. We present the efficiency maps recorded with the microfocus beam and a sample powder diffraction measurement. These results give confidence that this sensor technology can be used effectively in larger arrays of detectors at synchrotron light sources.
|
Oct 2017
|
|
Detectors
|
J. A.
Mir
,
R.
Clough
,
R.
Macinnes
,
C.
Gough
,
R.
Plackett
,
I.
Shipsey
,
H.
Sawada
,
I.
Maclaren
,
R.
Ballabriga
,
D.
Maneuski
,
V.
O'shea
,
D.
Mcgrouther
,
A. I.
Kirkland
Abstract: In this paper we report quantitative measurements of the imaging performance for the current generation of hybrid pixel detector, Medipix3, used as a direct electron detector. We have measured the modulation transfer function and detective quantum efficiency at beam energies of 60 & 80 keV. In single pixel mode, energy threshold values can be chosen to maximize either the modulation transfer function or the detective quantum efficiency, obtaining values near to, or exceeding those for a theoretical detector with square pixels. The Medipix3 charge summing mode delivers simultaneous, high values of both modulation transfer function and detective quantum efficiency. We have also characterized the detector response to single electron events and describe an empirical model that predicts the detector modulation transfer function and detective quantum efficiency based on energy threshold. Exemplifying our findings we demonstrate the Medipix3 imaging performance recording a fully exposed electron diffraction pattern at 24-bit depth together with images in single pixel and charge summing modes. Our findings highlight that for transmission electron microscopy performed at low energies (energies <100 keV) thick hybrid pixel detectors provide an advantageous architecture for direct electron imaging.
|
Jun 2017
|
|
B16-Test Beamline
|
Kestutis
Kanisauskas
,
A.
Affolder
,
K.
Arndt
,
Richard
Bates
,
M.
Benoit
,
F. Di
Bello
,
A.
Blue
,
D.
Bortoletto
,
M.
Buckland
,
Craig
Buttar
,
P.
Caragiulo
,
D.
Das
,
J.
Dopke
,
A.
Dragone
,
F.
Ehrler
,
V.
Fadeyev
,
Z.
Galloway
,
H.
Grabas
,
I. M.
Gregor
,
P.
Grenier
,
A.
Grillo
,
B.
Hiti
,
M.
Hoeferkamp
,
L. B. A.
Hommels
,
B. T.
Huffman
,
J.
John
,
C.
Kenney
,
J.
Kramberger
,
Z.
Liang
,
I.
Mandic
,
Dzmitry
Maneuski
,
F.
Martinez-mckinney
,
S.
Macmahon
,
L.
Meng
,
M.
Mikuž
,
D.
Muenstermann
,
R.
Nickerson
,
I.
Peric
,
P.
Phillips
,
R.
Plackett
,
F.
Rubbo
,
J.
Segal
,
S.
Seidel
,
A.
Seiden
,
I.
Shipsey
,
W.
Song
,
M.
Staniztki
,
D.
Su
,
C.
Tamma
,
R.
Turchetta
,
L.
Vigani
,
J.
Volk
,
R.
Wang
,
M.
Warren
,
F.
Wilson
,
S.
Worm
,
Qinglei
Xiu
,
J.
Zhang
,
H.
Zhu
Diamond Proposal Number(s):
[10391]
Open Access
Abstract: CMOS active pixel sensors are being investigated for their potential use in the ATLAS inner tracker upgrade at the HL-LHC. The new inner tracker will have to handle a significant increase in luminosity while maintaining a sufficient signal-to-noise ratio and pulse shaping times. This paper focuses on the prototype chip "HVStripV1" (manufactured in the AMS HV-CMOS 350nm process) characterization before and after irradiation up to fluence levels expected for the strip region in the HL-LHC environment. The results indicate an increase of depletion region after irradiation for the same bias voltage by a factor of ≈2.4 and ≈2.8 for two active pixels on the test chip. There was also a notable increase in noise levels from 85 e− to 386 e− and from 75 e− to 277 e− for the corresponding pixels.
|
Feb 2017
|
|
|
|
K.
Akiba
,
J.
Alozy
,
R.
Aoude
,
M. Van
Beuzekom
,
J.
Buytaert
,
P.
Collins
,
A. Dosil
Suárez
,
R.
Dumps
,
A.
Gallas
,
C.
Hombach
,
Daniel
Hynds
,
M.
John
,
A.
Leflat
,
Y.
Li
,
E. Pérez
Trigo
,
Richard
Plackett
,
M. M.
Reid
,
P. Rodríguez
Pérez
,
H.
Schindler
,
P.
Tsopelas
,
C. Vázquez
Sierra
,
J. J.
Velthuis
,
M.
Wysokiński
Abstract: While designed primarily for X-ray imaging applications, the Medipix3 ASIC can also
be used for charged-particle tracking. In this work, results from a beam test at the CERN SPS with
irradiated and non-irradiated sensors are presented and shown to be in agreement with simulation,
demonstrating the suitability of the Medipix3 ASIC as a tool for characterising pixel sensors.
|
Jan 2016
|
|
B16-Test Beamline
|
Eva
Gimenez-navarro
,
Rafael
Ballabriga
,
Gabriel
Blaj
,
Michael
Campbell
,
Igor
Dolbnya
,
Erik
Frodjh
,
Ian
Horswell
,
Xavier
Llopart-cudie
,
Julien
Marchal
,
John
Mcgrath
,
David
Omar
,
Richard
Plackett
,
Kawal
Sawhney
,
Nicola
Tartoni
Abstract: The Medipix3RX is the latest version of the Medipix3 photon counting ASICs, which implements two new operational modes, with respect to the Medipix2 ASIC, aimed at eliminating charge shared events (referred to as Charge Summing Mode (CSM)) and at providing spectroscopic information (referred to as Colour Mode (CM)). The Medipix3RX is a redesign of the Medipix3v0 ASIC and corrects for the underperformance of CSM features observed in the previous version. This paper presents the results from synchrotron X-rays tests to evaluate the Medipix3RX ASIC performance. The newly implemented CSM algorithm eliminates the charge sharing effect at the same time as allocating the event to the readout pixel corresponding to the sensor pixel where the X-ray photon impinged. The new pixel trimming circuit led to a reduced dispersion between pixels. Further results of the linearity for all the gain modes, energy resolution and pixel uniformity are also presented.
|
Jun 2015
|
|
B16-Test Beamline
|
Dzmitry
Maneuski
,
Richard
Bates
,
Andrew
Blue
,
C.
Buttar
,
Kate
Doonan
,
Lars
Eklund
,
Eva
Gimenez-navarro
,
D.
Hynds
,
Slava
Kachkanov
,
J.
Kalliopuska
,
Thomas
Mcmullen
,
V.
O'shea
,
Nicola
Tartoni
,
Richard
Plackett
,
S.
Vahanen
,
Kennenth
Wraight
Diamond Proposal Number(s):
[9405, 10390]
Open Access
Abstract: Silicon sensor technologies with reduced dead area at the sensor's perimeter are under development at a number of institutes. Several fabrication methods for sensors which are sensitive close to the physical edge of the device are under investigation utilising techniques such as active-edges, passivated edges and current-terminating rings. Such technologies offer the goal of a seamlessly tiled detection surface with minimum dead space between the individual modules. In order to quantify the performance of different geometries and different bulk and implant types, characterisation of several sensors fabricated using active-edge technology were performed at the B16 beam line of the Diamond Light Source. The sensors were fabricated by VTT and bump-bonded to Timepix ROICs. They were 100 and 200 μm thick sensors, with the last pixel-to-edge distance of either 50 or 100 μm. The sensors were fabricated as either n-on-n or n-on-p type devices. Using 15 keV monochromatic X-rays with a beam spot of 2.5 μm, the performance at the outer edge and corners pixels of the sensors was evaluated at three bias voltages. The results indicate a significant change in the charge collection properties between the edge and 5th (up to 275 μm) from edge pixel for the 200 μ m thick n-on-n sensor. The edge pixel performance of the 100 μm thick n-on-p sensors is affected only for the last two pixels (up to 110 μm) subject to biasing conditions. Imaging characteristics of all sensor types investigated are stable over time and the non-uniformities can be minimised by flat-field corrections. The results from the synchrotron tests combined with lab measurements are presented along with an explanation of the observed effects.
|
Mar 2015
|
|
|
|
K.
Akiba
,
M.
Artuso
,
V.
Van Beveren
,
M.
Van Beuzekom
,
H.
Boterenbrood
,
J.
Buytaert
,
P.
Collins
,
R.
Dumps
,
B.
Van Der Heijden
,
C.
Hombach
,
D.
Hynds
,
D.
Hsu
,
M.
John
,
E.
Koffeman
,
A.
Leflat
,
Y.
Li
,
I.
Longstaff
,
A.
Morton
,
E.
Pérez Trigo
,
R
Plackett
,
M M
Reid
,
P.
Rodríguez Perez
,
H.
Schindler
,
P.
Tsopelas
,
C.
Vázquez Sierra
,
M.
Wysokiński
Abstract: The performance of prototype active-edge VTT sensors bump-bonded to the Timepix ASIC is presented. Non-irradiated sensors of thicknesses 100–200 μm and pixel-to-edge distances of 50 μm and 100 μm were probed with a beam of charged hadrons with sub-pixel precision using the Timepix telescope assembled at the SPS at CERN. The sensors are shown to be highly efficient up to a few micrometers from the physical edge of the sensor. The distortion of the electric field lines at the edge of the sensors is studied by reconstructing the streamlines of the electric field using two-pixel clusters. These results are supported by TCAD simulations. The reconstructed streamlines are used to study the field distortion as a function of the bias voltage and to apply corrections to the cluster positions at the edge.
|
Mar 2015
|
|
Detectors
|
Abstract: A simulation toolkit developed for use at Diamond Light Source is presented, accompanied with experimental validation using a silicon pixel-array sensor coupled to a Medipix3RX chip controlled via the Merlin Readout System.
The simulation makes use of Geant4, where photons are tracked in order to determine their position of interaction and energy deposition. Further to this, a Finite Element Methods package, Comsol, is used to model the Charge Induction Efficiencies of various sensors. Results are coupled to Geant4 simulations to provide an accurate method for computing the signals generated on each pixel within the sensor and then an algorithm to model the front-end electronics of the device.
The validity of the simulation toolkit is tested by investigating charge-sharing effects using a Medipix3RX chip bump-bonded to a silicon pixel-array sensor. The dependence of the imaging parameters, on the energy threshold, is presented from both simulation and experiment for the Medipix3RX chip operated with and without the charge sharing compensation circuitry enabled.
This simulation toolkit can be used to calculate image quality parameters for the next generation of detectors, including CdTe, as well as to improve data corrections on existing detectors on synchrotron beamlines.
|
May 2014
|
|
|
|
K.
Akiba
,
P.
Ronning
,
M.
Van Beuzekom
,
V.
Van Beveren
,
S.
Borghi
,
H.
Boterenbrood
,
J.
Buytaert
,
P.
Collins
,
A.
Dosil Suárez
,
R.
Dumps
,
L.
Eklund
,
D.
Esperante
,
A.
Gallas
,
H.
Gordon
,
B.
Van Der Heijden
,
C.
Hombach
,
D.
Hynds
,
M.
John
,
A.
Leflat
,
Y.
Li
,
I.
Longstaff
,
A.
Morton
,
N.
Nakatsuka
,
A.
Nomerotski
,
C.
Parkes
,
E.
Perez Trigo
,
R.
Plackett
,
M. M.
Reid
,
P.
Rodriguez Perez
,
H.
Schindler
,
T.
Szumlak
,
P.
Tsopelas
,
C.
Vázquez Sierra
,
J.
Velthuis
,
M.
Wysokiński
Abstract: The Timepix particle tracking telescope has been developed as part of the LHCb VELO Upgrade project, supported by the Medipix Collaboration and the AIDA framework. It is a primary piece of infrastructure for the VELO Upgrade project and is being used for the development of new sensors and front end technologies for several upcoming LHC trackers and vertexing systems. The telescope is designed around the dual capability of the Timepix ASICs to provide information about either the deposited charge or the timing information from tracks traversing the 14×14 mm matrix of View the MathML source pixels. The rate of reconstructed tracks available is optimised by taking advantage of the shutter driver readout architecture of the Timepix chip, operated with existing readout systems. Results of tests conducted in the SPS North Area beam facility at CERN show that the telescope typically provides reconstructed track rates during the beam spills of between 3.5 and 7.5 kHz, depending on beam conditions. The tracks are time stamped with 1 ns resolution with an efficiency of above 98% and provide a pointing resolution at the centre of the telescope of View the MathML source. By dropping the time stamping requirement the rate can be increased to View the MathML source, at the expense of a small increase in background. The telescope infrastructure provides CO2 cooling and a flexible mechanical interface to the device under test, and has been used for a wide range of measurements during the 2011–2012 data taking campaigns.
|
Apr 2013
|
|
Detectors
|
J.
Marchal
,
I.
Horswell
,
B.
Willis
,
R.
Plackett
,
E. N.
Gimenez-navarro
,
J.
Spiers
,
D.
Ballard
,
P.
Booker
,
J. A.
Thompson
,
P.
Gibbons
,
S. R.
Burge
,
T.
Nicholls
,
J.
Lipp
,
N.
Tartoni
Abstract: Coherent X-ray diffraction experiments on synchrotron X-ray beamlines require detectors with high spatial resolution and large detection area. The read-out chip developed by the MEDIPIX3 collaboration offers a small pixel size of 55 microns resulting in a very high spatial resolution when coupled to a direct X-ray conversion segmented silicon sensor. MEDIPIX3 assemblies present also the advantages of hybrid pixel detectors working in single photon counting mode: noiseless imaging, large dynamic range, extremely high frame rate. The EXCALIBUR detector is under development for the X-ray Coherence and Imaging Beamline I13 of the Diamond Light Source. This new detector consists of three modules, each with 16 MEDIPIX3 chips which can be read-out at 100 frames per second in continuous mode or 1000 frames per second in burst mode. In each module, the sensor is a large single silicon die covering 2 rows of 8 individual MEDIPIX3 read-out chips and provides a continuous active detection region within a module. Each module includes 1 million solder bumps connecting the 55 microns pixels of the silicon sensor to the 55 microns pixels of the 16 MEDIPIX3 read-out chips. The detection area of the 3-module EXCALIBUR detector is 115 mm × 100 mm with a small 6.8 mm wide inactive region between modules. Each detector module is connected to 2 FPGA read-out boards via a flexi-rigid circuit to allow a fully parallel read-out of the 16 MEDIPIX3 chips. The 6 FPGA read-out boards used in the EXCALIBUR detector are interfaced to 6 computing nodes via 10Gbit/s fibre-optic links to maintain the very high frame-rate capability. The standard suite of EPICS control software is used to operate the detector and to integrate it with the Diamond Light Source beamline software environment. This article describes the design, fabrication and characterisation of the MEDIPIX3-based modules composing the EXCALIBUR detector.
|
Mar 2013
|
|
