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Robust measurements of functional material properties using in situ 4D-STEM

DOI: 10.1017/S1431927622008881 DOI Help

Authors: Colin Ophus (Lawrence Berkeley National Laboratory) , Michele Conroy (Imperial College London) , Mohsen Danaie (Diamond Light Source) , Benjamin H. Savitzky (Lawrence Berkeley National Laboratory) , Alexander Rakowski (Lawrence Berkeley National Laboratory) , Abigail Ackerman (Imperial College London) , Steven E. Zeltmann (University of California, Berkeley) , Jim Ciston (Lawrence Berkeley National Laboratory) , Andrew M Minor (Lawrence Berkeley National Laboratory; University of California, Berkeley) , David Dye (Imperial College London)
Co-authored by industrial partner: No

Type: Conference Paper
Conference: Microscopy & Microanalysis 2022: P09 - Insights into Phase Transitions in Functional Materials by in situ/operando TEM: Experiment Meets Theory
Peer Reviewed: No

State: Published (Approved)
Published: August 2022

Abstract: Conventional scanning transmission electron microscopy (STEM) imaging experiments record only a few values per probe position, generating bright field or dark field images, consisting of unscattered or scattered electrons respectively. The contrast in these images is highly sensitive to changes in local structure and the resolution is sufficient to resolve individual atoms. Unfortunately, many real-world samples in materials science studies are too thick or too complex to easily measure the structural properties of interest in this manner. An alternative to conventional STEM imaging is to use a high-speed direct electron detector, which records a full image (2D data) of the diffracted electron probe scanned over the sample (2D grid of positions), producing a four-dimensional measurement known as 4D-STEM. These 4D-STEM measurements of millions of diffraction patterns are extremely rich in information, but require efficient and robust software in order to measure sample properties. We have developed the py4DSTEM open source analysis toolkit to perform these analyses.

Subject Areas: Information and Communication Technology, Materials, Technique Development

Technical Areas:

Added On: 27/07/2022 11:57

Discipline Tags:

Technique Development - Materials Science Computing & software technologies Information & Communication Technologies Materials Science

Technical Tags: