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Testbeam studies on pick-up in sensors with embedded pitch adapters

DOI: 10.1016/j.nima.2018.06.079 DOI Help

Authors: L. Rehnisch (Humboldt-Universität zu Berlin) , I. Bloch (Deutsches Elektronen-Synchrotron (DESY)) , A. Blue (SUPA School of Physics and Astronomy, University of Glasgow) , Craig Buttar (SUPA School of Physics and Astronomy, University of Glasgow) , J. Fernández-tejero (Instituto de Microelectrónica de Barcelona, IMB-CNM (CSIC)) , C. Fleta (Instituto de Microelectrónica de Barcelona, IMB-CNM (CSIC)) , Bruce Gallop (STFC Rutherford Appleton Laboratory) , T. Lohse (Humboldt-Universität zu Berlin) , K. Lohwasser (University of Sheffield) , P. W. Phillips (STFC Rutherford Appleton Laboratory) , L. Poley (Deutsches Elektronen-Synchrotron (DESY)) , C. Sawyer (STFC Rutherford Appleton Laboratory) , M. Stegler (Deutsches Elektronen-Synchrotron (DESY)) , M. Ullán (Instituto de Microelectrónica de Barcelona, IMB-CNM (CSIC))
Co-authored by industrial partner: No

Type: Journal Paper
Journal: Nuclear Instruments And Methods In Physics Research Section A: Accelerators, Spectrometers, Detectors And Associated Equipment

State: Published (Approved)
Published: June 2018
Diamond Proposal Number(s): 15979

Abstract: Embedded pitch adapters are an alternative solution to external pitch adapters widely used to facilitate the wire-bonding step when connecting silicon strip sensors and readout electronics of different pitch. The pad-pitch adaption can be moved into the sensor fabrication step by implementing a second layer of metal tracks, connected by vias to the primary metal layer of sensor strips. Such a solution, however, might bear the risk of performance losses introduced by various phenomena. One of these effects, the undesired capacitive coupling between the silicon bulk and this second metal layer (pick-up) has been investigated in photon testbeam measurements. For a worst-case embedded pitch adapter design, expected to be maximally susceptible to pick-up, a qualitative analysis has visualized the effect as a function of the location on the second metal layer structure. It was further found that the unwanted effect decreases towards expected values for operating thresholds of the binary readout used. Suggestions for more in-depth and quantitative studies are also derived.

Journal Keywords: Silicon strip sensors; Embedded pitch adapters; Pick-up

Subject Areas: Physics

Instruments: B16-Test Beamline

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